Advanced substrate quality is becoming the constraint on CoWoS yield. As AI packages grow larger and integrate more HBM stacks, dimensional accuracy and warpage control become increasingly important. Small deviations can materially reduce packaging yield. Kinsus is one of TSMC’s important advanced
@tengyanai·Jul 19, 2026·2 sources·neutral
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Advanced substrate quality constraints are limiting CoWoS yield, affecting TSMC's AI packaging capacity.
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Advanced substrate quality is becoming the constraint on CoWoS yield. As AI packages grow larger and integrate more HBM stacks, dimensional accuracy and warpage control become increasingly important. Small deviations can materially reduce packaging yield. Kinsus is one of TSMC’s important advanced
@tengyanai
Jul 19, 2026
Advanced substrate quality is becoming the constraint on CoWoS yield. As AI packages grow larger and integrate more HBM stacks, dimensional accuracy and warpage control become increasingly important. Small deviations can materially reduce packaging yield. Kinsus is one of TSMC’s important advanced
@tengyanai
Jul 19, 2026